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2017

Kahl O, Ferrari S, Kovalyuk V, Vetter A, Lewes-Malandrakis G, Nebel C, et al. Spectrally multiplexed single-photon detection with hybrid superconducting nanophotonic circuits: supplementary material. Osa; 2017.
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Klapwijk TM, Semenov AV. Engineering physics of superconducting hot-electron bolometer mixers. IEEE Trans THz Sci Technol. 2017;7(6):627–48.
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Korneev A, Kovalyuk V, Ferrari S, Kahl O, Pernice W, An P, et al. Superconducting Single-Photon Detectors for Integrated Nanophotonics Circuits. In: 16th ISEC.; 2017. p. 1–3.
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Korneev A, Semenov A, Vodolazov D, Gol’tsman GN, Sobolewski R. Physics and operation of superconducting single-photon devices. In: Wördenweber R, Moshchalkov V, Bending S, Tafuri F, editors. Superconductors at the Nanoscale. De Gruyter; 2017. p. 279–308.
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Korneeva Y, Florya I, Vdovichev S, Moshkova M, Simonov N, Kaurova N, et al. Comparison of hot spot formation in nbn and mon thin superconducting films after photon absorption. IEEE Trans Appl Supercond. 2017;27(4):1–4.
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Korneeva Y, Florya I, Vdovichev S, Moshkova M, Simonov N, Kaurova N, et al. Comparison of hot-spot formation in NbN and MoN thin superconducting films after photon absorption. In: IEEE Transactions on Applied Superconductivity. Vol 27.; 2017. 5.
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Kovalyuk V, Ferrari S, Kahl O, Semenov A, Lobanov Y, Shcherbatenko M, et al. Waveguide integrated superconducting single-photon detector for on-chip quantum and spectral photonic application. In: J. Phys.: Conf. Ser. Vol 917.; 2017. 062032.
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Kovalyuk V, Ferrari S, Kahl O, Semenov A, Lobanov Y, Shcherbatenko M, et al. Waveguide integrated superconducting single-photon detector for on-chip quantum and spectral photonic application.; 2017.
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Kovalyuk V, Ferrari S, Kahl O, Semenov A, Shcherbatenko M, Lobanov Y, et al. On-chip coherent detection with quantum limited sensitivity. Sci Rep. 2017;7(1):4812.
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Krause S, Mityashkin V, Antipov S, Gol’tsman G, Meledin D, Desmaris V, et al. Reduction of phonon escape time for nbn hot electron bolometers by using gan buffer layers. IEEE Trans Terahertz Sci Technol. 2017;7(1):53–9.
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