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Wild, W., Baryshev, A., de Graauw, T., Kardashev, N., Likhachev, S., Goltsman, G., et al. (2008). Instrumentation for Millimetron – a large space antenna for THz astronomy. In Proc. 19th Int. Symp. Space Terahertz Technol. (pp. 186–191).
Abstract: Millimetron is a Russian-led 12m diameter submillimeter and far-infrared space observatory which is included in the Space Plan of the Russian Federation and funded for launch after 2015. With its large collecting area and state-of-the-art receivers, it will enable unique science and allow at least one order of magnitude improvement with respect to the Herschel Space Observatory. Millimetron is currently in a conceptual design phase carried out by the Astro Space Center in Moscow and SRON Netherlands Institute for Space Research. It will use a passively cooled deployable antenna with a high-precision central 3.5m diameter mirror and high- precision antenna petals. The antenna is specified for observations up to ~2 THz over the whole 12m diameter, and to higher frequencies using the central 3.5m solid mirror. Millimetron will be operated in two basic observing modes: as a single-dish observatory, and as an element of a ground-space VLBI system. As single-dish, angular resolutions on the order of 3 to 12 arcsec will be achieved and spectral resolutions of up to 10 6 employing heterodyne techniques. As VLBI antenna, the chosen elliptical orbit will provide extremely large VLBI baselines resulting in micro-arcsec angular resolution. The scientific payload will consist of heterodyne and direct detection instruments covering the most important sub-/millimeter spectral regions (including some ALMA bands) and will build on the Herschel and ALMA heritage.
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Smirnov, A., Golubev, E., Arkhipov, M., Filina, E., Pyshnov, V., Myshonkova, N., et al. (2019). Millimetron Space Observatory: progress in the development of payload module. In Proc. 30th Int. Symp. Space Terahertz Technol. (pp. 180–181).
Abstract: Millimetron Space Observatory (MSO) is mission addressed to creation a space cryogenic telescope with aperture about 10-m [1]. Such telescope will allow scientific community to have an astronomical instrument with enormous sensitivity and angular resolution in the submillimeter and far-infrared wavelength ranges. We plan to install at the telescope several FIR and sub-millimeter scientific instruments, which will enable high-resolution imaging and spectroscopy observations with unprecedented sensitivity. At the same time, MSO will enable observations with an extremely high angular resolution (up to 0.1×10 -6 arcsec) as an element of a ground-space very long baseline interferometry system (S-VLBI). Thereby the observatory will contribute breakthrough capability into solution a number of cosmology and fundamental astrophysics questions about the origin and evolution of our Universe, galaxies, stars and other objects [2]. The MSO is divided into two parts: the payload module and the bus module. Due to the complexity of the payload module, most of the recent years of work are focused on it. This module includes an antenna of the telescope, scientific receivers, functional and service systems and a high-gain radio system for transmitting scientific data to Earth. The primary mirror of the telescope will be deployable and consist from of a 3-m aperture central part surrounded by 24 deployable petals. The concept of petals deployment is based on the successfully launched and currently working Radioastron project [3]. The surface accuracy of the deployable 10-m primary mirror of Radioastron achieves about 1 mm in space conditions. The telescope of MSO would have much better surface accuracy – less than 10 μm (rms). In order to achieve this we plan to use an active surface control system based on a wave front sensing. This system will be periodically employed to correct inaccuracies in the positions of the panels caused by different factors. A combination of a high modulus carbon fiber reinforced plastic (CFRP) and a cyanate ester resin as a binder provides a lightweight structure with low moisture absorption, high thermal stability and high stiffness. This combination has been chosen for the material of the primary mirror of telescope and many parts of it. The panels are mounted on the back support structure (Fig. 1) made from CFRP via precision cryogenic actuators. To achieve the required sensitivity of the telescope in the submm/FIR we need to cool antenna down to the temperature less than 10K (goal). It may be possible to do this on-orbit only by a combination of effective radiation cooling and additional active mechanical cooling. A cold space antenna requires minimization and stability of external thermal radiation. This is one of the reasons why MSO will be placed into orbit around the second Earth-Sun Lagrange point (L2). The MSO antenna into L2 will be cooled passively to a temperature about 30 – 60K by a suite of the deployable multi-layer V-groove shields. The following steps to reduce the temperature of the antenna are based on active reducing the thermal loads applied to it. Active mechanical cooling is based on existing close cycling space mechanical coolers. In this work, we will focus on the progress in the development of payload module.
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Darula, M., Semenov, A. D., Hübers, H. - W., & Schubert, J. (2000). Quasioptical high-Tc superconductor Josephson mixer at terahertz frequencies. In Proc. 11th Int. Symp. Space Terahertz Technol. (515).
Abstract: Mixers based on Josephson junctions from conventional superconductor materials have demonstrated excellent performance at subgap frequencies. The advantages of Josephson mixers are low optimal power of the local oscillator and large intermediate frequency bandwidth but their noise temperature increases dramatically at frequencies corresponding to the energy gap of the superconductor, which is typically below 1 THz for widely used materials. The large energy gap of oxide superconductors makes them promising candidates for development of terahertz Josephson mixers. Here we report on experimental study of the quasioptical mixer utilizing bicrystal Josephson junction from high-transition-temperature YBa 2 Cu 3 O 7-δ film. Junctions with a width of 2 µm were fabricated from 100 nm thick laser ablated films on bicrystal MgO substrates and had the and the J C R n product of about 2 mV at 4.2 K. The planar complementary logarithmic spiral antenna incorporated into co-planar waveguide was patterned from 200 nm thick gold film thermally evaporated in situ on top of the YBa 2 Cu 3 O 7-δ film. The mixer chip was clamped to the extended hemispherical silicon lens. Performance of the mixer was investigated at 4.5 K bath temperature. We used FIR laser as a local oscillator at frequencies 0.698 and 2.52 THz. System noise temperature (DSB) was determined from Y-factor measured with 300 K and 77 K loads. At 0.698 THz the lowest noise temperature 1750 K was observed when the mixer was biased with the fixed current to the region in the vicinity of either the first Shapiro step or the critical current. Between these two bias points the noise temperature increased to ≈ 20000 K. As function of the local oscillator power the noise temperature reached the minimum when the critical current was suppressed to the half of its equilibrium value. Power of the local oscillator absorbed by the mixer at optimal operation was of the order 100 nW. The present design of our antenna limits the upper operation frequency to the value of 1.8 THz. Nevertheless, we clearly observed Shapiro steps at the frequency 2.52 THz. Bearing in mind an improved design of the antenna, we estimate the 3000 K DSB noise temperature at this frequency.
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Ekström, H., Karasik, B., Kollberg, E., & Yngvesson, K. S. (1994). Investigation of a superconducting hot electron mixer. In Proc. 5th Int. Symp. Space Terahertz Technol. (pp. 169–188).
Abstract: Mixing at 20 GHz in niobium superconducting thin film strips in the resistive state is studied. Experiments give evidence that electron-heating is the main cause of the non linear phenomena. The requirements on the mode of operation and on the film parameters for small conversion loss and the possibility of conversion gain are discussed. Measurements indicate a minimum intrinsic conversion loss around 1 dB with a sharp drop for the lowest voltage bias-points, and a DSB mixer noise temperature between 100 and 450 K at 20 GHz. The device output noise temperature at the mixer operating point can be as low as 30-50 K. A simple theory is presented, which is based on the assumption that the small signal resistance is linearly dependent on power. This type of mixer is considered very promising for use in low-noise heterodyne receivers at THz frequencies.
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Zvagelsky, R. D., Chubich, D. A., Kolymagin, D. A., Korostylev, E. V., Kovalyuk, V. V., Prokhodtsov, A. I., et al. (2020). Three-dimensional polymer wire bonds on a chip: morphology and functionality. J. Phys. D: Appl. Phys., 53(35), 355102.
Abstract: Modern microchip-scale transceivers are capable of transmitting data at rates of the order of several terabits per second. In this regard, there is an urgent need to improve the interfaces connecting the chips and extend the bandpass of the interconnections. We use an approach combining silicon nitride nanophotonic circuits with 3D polymer waveguides fabricated by direct laser writing, which can be used as photonic interconnections or photonic wire bonds (PWB). These structures are designed, simulated, fabricated, and optimized for better light transmission at the telecommunication wavelength. An important part of this work is the study of the telecom signal transmission in a 3D polymer waveguide connecting two silicon nitride facing tapers. Two cases are considered: the tapers are one opposite the other or misaligned. Initially, the PWB shape was chosen to be Gaussian and then optimized: the top was circle-shaped and with the lower part still being Gaussian. Transmission losses were measured for both types of waveguides with different shapes. The idea of an optical multi-level crossing for photonic integrated circuits is also suggested as a solution to the problem of interconnections within a single chip.
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