| Author |
Title |
Year |
Publication |
Volume |
Pages |
| Bennett, Douglas A.; Schmidt, Daniel R.; Swetz, Daniel S.; Ullom, Joel N. |
Phase-slip lines as a resistance mechanism in transition-edge sensors |
2014 |
Appl. Phys. Lett. |
104 |
042602 |
| Hoevers, H. F. C.; Bento, A. C.; Bruijn, M. P.; Gottardi, L.; Korevaar, M. A. N.; Mels, W. A.; de Korte, P. A. J. |
Thermal fluctuation noise in a voltage biased superconducting transition edge thermometer |
2000 |
Applied Physics Letters |
77 |
4421-4424 |
| Titova, N; Kardakova, A.; Tovpeko, N; Ryabchun, S.; Mandal, S.; Morozov, D.; Klemencic, G. M.; Giblin, S.R.; Williams, O. A.; Goltsman, G. N. |
Superconducting diamond films as perspective material for direct THz detectors |
2017 |
Proc. 28th Int. Symp. Space Terahertz Technol. |
|
82 |
| Gorokhov, G.; Bychanok, D.; Gayduchenko, I.; Rogov, Y.; Zhukova, E.; Zhukov, S.; Kadyrov, L.; Fedorov, G.; Ivanov, E.; Kotsilkova, R.; Macutkevic, J.; Kuzhir, P. |
THz spectroscopy as a versatile tool for filler distribution diagnostics in polymer nanocomposites |
2020 |
Polymers (Basel) |
12 |
3037 (1 to 14) |
| Manus, M. K. Mc; Kash, J. A.; Steen, S. E.; Polonsky, S.; Tsang, J.C.; Knebel, D. R.; Huott, W. |
PICA: Backside failure analysis of CMOS circuits using picosecond imaging circuit analysis |
2000 |
Microelectronics Reliability |
40 |
1353-1358 |
