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Tretyakov, I., Shurakov, A., Perepelitsa, A., Kaurova, N., Svyatodukh, S., Zilberley, T., et al. (2019). Silicon room temperature IR detectors coated with Ag2S quantum dots. In Proc. IWQO (pp. 369–371).
Abstract: For decades silicon has been the chief technological semiconducting material of modern microelectronics. Application of silicon detectors in optoelectronic devices are limited to the visible and near infrared ranges, due to their transparency for radiation with a wavelength higher than 1.1 μm. The expansion Si absorption towards longer wave lengths is a considerable interest to optoelectronic applications. In this work we present an elegant and effective solution to this problem using Ag2S quantum dots, creating impurity states in Si to cause sub-band gap photon absorption. The sensitivity of room temperature zero-bias Si_Ag2S detectors, which we obtained is 1011 cmHzW . Given the variety of QDs parameters such as: material, dimensions, our results open a path towards the future study and development of Si detectors for technological applications.
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Gershenzon, E. M., Gol'tsman, G. N., & Ptitsyna, N. G. (1977). Carrier lifetime in excited states of shallow impurities in germanium. JETP Lett., 25(12), 539–543.
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Gershenzon, E. M., Goltsman, G. N., & Orlov, L. (1976). Investigation of population and ionization of donor excited states in Ge. In Physics of Semiconductors (pp. 631–634). North-Holland Publishing Co.
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Gershenzon, E., Goltsman, G., Orlov, L., & Ptitsina, N. (1978). Population of excited-states of small admixtures in germanium. In Izv. Akad. Nauk SSSR, Seriya Fizicheskaya (Vol. 42, pp. 1154–1159). Mezhdunarodnaya Kniga 39 Dimitrova Ul., 113095 Moscow, Russia.
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Gershenzon, E. M., Goltsman, G. N., & Ptitsyna, N. G. (1974). Investigation of excited donor states in GaAs. Sov. Phys. Semicond., 7(10), 1248–1250.
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Manus, M. K. M., Kash, J. A., Steen, S. E., Polonsky, S., Tsang, J. C., Knebel, D. R., et al. (2000). PICA: Backside failure analysis of CMOS circuits using picosecond imaging circuit analysis. Microelectronics Reliability, 40, 1353–1358.
Abstract: Normal operation of complementary metal-oxide semiconductor (CMOS) devices entails the emission of picosecond pulses of light, which can be used to diagnose circuit problems. The pulses that are observed from submicron sized field effect transistors (FETs) are synchronous with logic state switching. Picosecond Imaging Circuit Analysis (PICA), a new optical imaging technique combining imaging with timing, spatially resolves individual devices at the 0.5 micron level and switching events on a 10 picosecond timescale. PICA is used here for the diagnostics of failures on two VLSI microprocessors.
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Prober, D. E. (1993). Superconducting terahertz mixer using a transition-edge microbolometer. Appl. Phys. Lett., 62(17), 2119–2121.
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Gorokhov, G., Bychanok, D., Gayduchenko, I., Rogov, Y., Zhukova, E., Zhukov, S., et al. (2020). THz spectroscopy as a versatile tool for filler distribution diagnostics in polymer nanocomposites. Polymers (Basel), 12(12), 3037 (1 to 14).
Abstract: Polymer composites containing nanocarbon fillers are under intensive investigation worldwide due to their remarkable electromagnetic properties distinguished not only by components as such, but the distribution and interaction of the fillers inside the polymer matrix. The theory herein reveals that a particular effect connected with the homogeneity of a composite manifests itself in the terahertz range. Transmission time-domain terahertz spectroscopy was applied to the investigation of nanocomposites obtained by co-extrusion of PLA polymer with additions of graphene nanoplatelets and multi-walled carbon nanotubes. The THz peak of permittivity's imaginary part predicted by the applied model was experimentally shown for GNP-containing composites both below and above the percolation threshold. The physical nature of the peak was explained by the impact on filler particles excluded from the percolation network due to the peculiarities of filler distribution. Terahertz spectroscopy as a versatile instrument of filler distribution diagnostics is discussed.
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Hoevers, H. F. C., Bento, A. C., Bruijn, M. P., Gottardi, L., Korevaar, M. A. N., Mels, W. A., et al. (2000). Thermal fluctuation noise in a voltage biased superconducting transition edge thermometer. Appl. Phys. Lett., 77(26), 4421–4424.
Abstract: The current noise at the output of a microcalorimeter with a voltage biased superconducting transition edge thermometer is studied in detail. In addition to the two well-known noise sources: thermal fluctuation noise from the heat link to the bath and Johnson noise from the resistive thermometer, a third noise source strongly correlated with the steepness of the thermometer is required to fit the measured noise spectra. Thermal fluctuation noise, originating in the thermometer itself, fully explains the additional noise. A simple model provides quantitative agreement between the observed and calculated noise spectra for all bias points in the superconducting transition.
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Miller, A. J., Lita, A. E., Calkins, B., Vayshenker, I., Gruber, S. M., & Nam, S. W. (2011). Compact cryogenic self-aligning fiber-to-detector coupling with losses below one percent. Opt. Express, 19(10), 9102–9110.
Abstract: We present a compact packaging technique for coupling light from a single-mode telecommunication fiber to cryogenic single-photon sensitive devices. Our single-photon detectors are superconducting transition-edge sensors (TESs) with a collection area only a factor of a few larger than the area of the fiber core which presents significant challenges to low-loss fiber-to-detector coupling. The coupling method presented here has low loss, cryogenic compatibility, easy and reproducible assembly and low component cost. The system efficiency of the packaged single-photon counting detectors is verified by the “triplet method†of power-source calibration along with the “multiple attenuator†method that produces a calibrated single-photon flux. These calibration techniques, when used in combination with through-wafer imaging and fiber back-reflection measurements, give us confidence that we have achieved coupling losses below 1 % for all devices packaged according to the self-alignment method presented in this paper.
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