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Baubert, J., Salez, M., Merkel, H., Pons, P., Cherednichenko, S., Lecomte, B., et al. (2005). IF gain bandwidth of membrane-based NbN hot electron bolometers for SHAHIRA. IEEE Trans. Appl. Supercond., 15(2), 507–510.
Abstract: SHAHIRA (Submm Heterodyne Array for HIgh-speed Radio Astronomy) is a project supported by the European Space Agency (ESA) and is designed to fly on the SOFIA observatory. A quasi-optic design has been chosen for 2.5/2.7 THz and 4.7 THz, for hydroxyde radical OH, deuterated hydrogen HD and neutral atomic oxygen OI lines observations. Hot electron bolometers (HEBs) have been processed on 1 /spl mu/m thick SiO/sub 2//Si/sub 3/N/sub 4/ stress-less membranes. In this paper we analyse the intermediate frequency (IF) gain bandwidth from the theoretical point of view, and compare it to measurements.
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Svechnikov, S. I., Antipov, S. V., Vakhtomin, Y. B., Goltsman, G. N., Gershenzon, E. M., Cherednichenko, S. I., et al. (2001). Conversion and noise bandwidths of terahertz NbN hot-electron bolometer mixers. Physics of Vibrations, 9(3), 205–210.
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Kawamura, J. H., Tong, C. - Y. E., Blundell, R., Cosmo Papa, D., Hunter, T. R., Gol'tsman, G., et al. (1999). An 800 GHz NbN phonon-cooled hot-electron bolometer mixer receiver. IEEE Trans. Appl. Supercond., 9(2), 3753–3756.
Abstract: We describe a heterodyne receiver developed for astronomical applications to operate in the 350 /spl mu/m atmospheric window. The waveguide receiver employs a superconductive NbN phonon-cooled hot-electron bolometer mixer. The double sideband receiver noise temperature closely follows 1 kGHz/sup -1/ across 780-870 GHz, with the intermediate frequency centered at 1.4 GHz. The conversion loss is about 15 dB. The receiver was installed for operation at the University of Arizona/Max Planck Institute for Radio Astronomy Submillimeter Telescope facility. The instrument was successfully used to conduct test observations of a number of celestial sources in a number of astronomically important spectral lines.
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Schwaab, G. W., Sirmain, G., Schubert, J., Hubers, H. - W., Gol'tsman, G., Cherednichenko, S., et al. (1999). Investigation of NbN phonon-cooled HEB mixers at 2.5 THz. IEEE Trans. Appl. Supercond., 9(2), 4233–4236.
Abstract: The development of superconducting hot electron bolometric (HEB) mixers has been a big step forward in the direction of quantum noise limited mixer performance at THz frequencies. Such mixers are crucial for the upcoming generation of airborne and spaceborne THz heterodyne receivers. In this paper we report on new results on a phonon-cooled NbN HEB mixer using e-beam lithography. The superconducting film is 3 nm thick. The mixer is 0.2 μm long and 1.5 μm wide and it is integrated in a spiral antenna on a Si substrate. The device is quasi-optically coupled through a Si lens and a dielectric beam combiner to the radiation of an optically pumped FIR ring gas laser cavity. The performance of the mixer at different THz frequencies from 0.69 to 2.55 THz with an emphasis on 2.52 THz is demonstrated. At 2.52 THz minimum DSB noise temperatures of 4200 K have been achieved at an IF of 1.5 GHz and a bandwidth of 40 MHz with the mixer mounted in a cryostat and a 0.8 m long signal path in air.
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Svechnikov, S. I., Okunev, O. V., Yagoubov, P. A., Gol'tsman, G. N., Voronov, B. M., Cherednichenko, S. I., et al. (1997). 2.5 THz NbN hot electron mixer with integrated tapered slot antenna. IEEE Trans. Appl. Supercond., 7(2), 3548–3551.
Abstract: A Hot Electron Bolometer (HEB) mixer for 2.5 THz utilizing a NbN thin film device, integrated with a Broken Linearly Tapered Slot Antenna (BLTSA), has been fabricated and is presently being tested. The NbN HEB device and the antenna were fabricated on a SiO2membrane. A 0.5 micrometer thick SiO2layer was grown by rf magnetron reactive sputtering on a GaAs wafer. The HEB device (phonon-cooled type) was produced as several parallel strips, 1 micrometer wide, from an ultrathin NbN film 4-7 nm thick, that was deposited onto the SiO2layer by dc magnetron reactive sputtering. The BLTSA was photoetched in a multilayer Ti-Au metallization. In order to strengthen the membrane, the front-side of the wafer was coated with a 5 micrometer thick polyimide layer just before the membrane formation. The last operation was anisotropic etching of the GaAs in a mixture of HNO3and H2O2.
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