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Author Чулкова, Г. М.; Семёнов, А. В.; Дивочий, А. В.; Тархов, М. А. url  openurl
  Title Сверхпроводниковый однофотонный детектор с разрешением числа фотонов для систем дальней телекоммуникационной связи Type Journal Article
  Year 2011 Publication Ж. радиоэлектрон. Abbreviated Journal Ж. радиоэлектрон.  
  Volume Issue 12 Pages 1-6  
  Keywords PNR SSPD, SNSPD  
  Abstract Рассмотрена возможность применения сверхпроводникового однофотонного детектора, разрешающего число фотонов, в качестве датчика приёмных модулей телекоммуникационных линий. Показано, что для достижения доли ошибочных битов на уровне 10-11 достаточно на два порядка меньшей мощности в оптическом импульсе, чем при использовании существующих приёмных модулей.  
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  Notes Approved no  
  Call Number RPLAB @ sasha @ чулковасверхпроводниковый Serial (down) 1031  
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Author Belitsky, V.; Desmaris, V.; Dochev, D.; Meledin, D.; Pavolotsky, A. openurl 
  Title Towards Multi-Pixel Heterodyne Terahertz Receivers Type Conference Article
  Year 2011 Publication Proc. 22th Int. Symp. Space Terahertz Technol. Abbreviated Journal  
  Volume Issue Pages  
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  Abstract Terahertz multi-pixel heterodyne receivers introduce multiple challenges for their implementation, mostly due to the extremely small dimensions of all components and even smaller tolerances in terms of alignment, linear dimensions and waveguide component surface quality. In this manuscript, we present a concept of terahertz multi-pixel heterodyne receiver employing optical layout using polarization split between the LO and RF. The frontend isbased on a waveguide balanced HEB mixer for the frequency band 1.6 – 2.0 THz. The balanced HEB mixer followsthe layout of earlier demonstrated APEX T2 mixer. However for the mixer presented here, we implemented split-block layout offering inimized lengths of all waveguides and thus reducing the associated RF loss. The micromachining methods employed for producing the mixer housing and the HEB mixer chip are very suitable for producing multiple structures and hence are in-line with requirements of multi-pixel receiver technology. The demonstrated relatively simple mounting of the mixer chip with self-aligning should greatly facilitate the integration of such multi-channel receiver. Index Terms—Instrumentation, Multi-pixel, Terahertz, Waveguide Balanced Mixer.  
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  Notes Approved no  
  Call Number RPLAB @ atomics90 @ Serial (down) 975  
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Author Galeazzi, Massimiliano openurl 
  Title Fundamental noise processes in TES devices Type Journal Article
  Year 2011 Publication IEEE Trans. Appl. Supercond. Abbreviated Journal IEEE Trans. Appl. Supercond.  
  Volume 21 Issue 3 Pages 267-271  
  Keywords TES, Johnson noise, phonon noise, excess noise, flux-flow noise, thermal fluctuation noise  
  Abstract Microcalorimeters and bolometers are noise-limited devices, therefore, a proper understanding of all noise sources is essential to predict and interpret their performance. In this paper, I review the fundamental noise processes contributing to Transition Edge Sensor (TES) microcalorimeters and bolometers and their effect on device performance. In particular, I will start with a simple, monolithic device model, moving to a more complex one involving discrete components, to finally move to today's more realistic, comprehensive model. In addition to the basic noise contribution (equilibrium Johnson noise and phonon noise), TES are significantly affected by extra noise, which is commonly referred to as excess noise. Different fundamental processes have been proposed and investigated to explain the origin of this excess noise, in particular near equilibrium non-linear Johnson noise, flux-flow noise, and internal thermal fluctuation noise. Experimental evidence shows that all three processes are real and contribute, at different levels, to the TES noise, although different processes become important at different regimes. It is therefore time to discard the term “excess noise” and consider these terms part of the “fundamental noise processes” instead.  
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  Notes Recommended by Klapwijk Approved no  
  Call Number Serial (down) 914  
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Author openurl 
  Title ГОСТ 3.1102-2011. ЕСТД. Стадии разработки и виды документов. Общие положения Type Book Whole
  Year 2011 Publication Abbreviated Journal  
  Volume Issue Pages  
  Keywords gost, detproj  
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  Notes Approved no  
  Call Number Serial (down) 864  
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Author Lee, B. G.; Assefa, S.; Green, W. M. J.; Min Yang; Schow, C. L.; Jahnes, C. V.; Sheng Zhang; Singer, J.; Kopp, V. I.; Kash, J. A.; Vlasov, Y. A. openurl 
  Title Multichannel high-bandwidth coupling of ultradense silicon photonic waveguide array to standard-pitch fiber array Type Journal Article
  Year 2011 Publication J. Lightwave Technol. Abbreviated Journal  
  Volume 29 Issue 4 Pages 475-482  
  Keywords optical waveguides, from chiralphotonics  
  Abstract A multichannel tapered coupler interfacing standard 250-μm-pitch low-numerical-aperture (NA) polarization-maintaining fiber arrays with ultradense 20- μm-pitch high-NA silicon waveguides is designed and fabricated. The coupler is based on an array of 12 dual-core glass waveguides on 250-μ m pitch that are tapered to a 20- μm pitch, simultaneously providing both pitch and spot-size conversion. At the wide end, the inner core matches the NA and mode profile of standard single-mode fiber. When drawn and tapered, the inner core “vanishes” and the outer core, surrounded by the clad, matches the NA and mode profile of the on-chip photonic waveguide. Ultradense high-efficiency coupling to an array of Si photonic waveguides is demonstrated using a 12-channel polarization-maintaining-fiber pigtailed tapered coupler. Coupling to Si waveguides is facilitated using SiON spot-size converters integrated into the Si photonic IC to provide 2-3-μm mode field diameters compatible with the tapered coupler. The tapered coupler achieves <; 1 dB coupling losses to photonic waveguides. Furthermore, eight-channel coupling is shown with less than -35 dB crosstalk between channels. Finally, a 640-Gb/s wavelength-division-multiplexing signal is coupled into four waveguides occupying 80 μm of chip edge, providing 160-Gb/s per-channel bandwidths.  
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  Notes Approved no  
  Call Number Serial (down) 849  
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