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Hübers, H. - W., Schubert, J., Krabbe, A., Birk, M., Wagner, G., Semenov, A., et al. (2001). Parylene anti-reflection coating of a quasi-optical hot-electron-bolometric mixer at terahertz frequencies. Infrared Physics & Technology, 42(1), 41–47.
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Antipov, S. V., Svechnikov, S. I., Smirnov, K. V., Vakhtomin, Y. B., Finkel, M. I., Goltsman, G. N., et al. (2001). Noise temperature of quasioptical NbN hot electron bolometer mixers at 900 GHz. Physics of Vibrations, 9(4), 242–245.
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Svechnikov, S. I., Antipov, S. V., Vakhtomin, Y. B., Goltsman, G. N., Gershenzon, E. M., Cherednichenko, S. I., et al. (2001). Conversion and noise bandwidths of terahertz NbN hot-electron bolometer mixers. Physics of Vibrations, 9(3), 205–210.
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Semenov, A. D., & Gol’tsman, G. N. (2000). Nonthermal mixing mechanism in a diffusion-cooled hot-electron detector. J. Appl. Phys., 87(1), 502–510.
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Gerecht, E., Musante, C. F., Zhuang, Y., Yngvesson, K. S., Gol’tsman, G. N., Voronov, B. M., et al. (1999). NbN hot electron bolometric mixerss—a new technology for low-noise THz receivers. IEEE Trans. Appl. Supercond., 47(12), 2519–2527.
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Gol’tsman, G. N., & Gershenzon, E. M. (1999). Phonon-cooled hot-electron bolometric mixer: overview of recent results. Appl. Supercond., 6(10-12), 649–655.
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Tong, C. E., Blundell, R., Papa, D. C., Smith, M., Kawamura, J., Gol'tsman, G., et al. (1999). An all solid-state superconducting heterodyne receiver at terahertz frequencies. IEEE Microw. Guid. Wave Lett., 9(9), 366–368.
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Gerecht, E., Musante, C. F., Jian, H., Yngvesson, K. S., Dickinson, J., Waldman, J., et al. (1999). New results for NbN phonon-cooled hot electron bolometric mixers above 1 THz. IEEE Trans. Appl. Supercond., 9(2), 4217–4220.
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Yagoubov, P., Kroug, M., Merkel, H., Kollberg, E., Schubert, J., Hubers, H. - W., et al. (1999). Heterodyne measurements of a NbN superconducting hot electron mixer at terahertz frequencies. IEEE Trans. Appl. Supercond., 9(2), 3757–3760.
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Gol'tsman, G. N. (1999). Hot electron bolometric mixers: new terahertz technology. Infrared Physics & Technology, 40(3), 199–206.
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