| Records |
| Author |
Gershenzon, E.; Goltsman, G.; Orlov, L.; Ptitsina, N. |
| Title |
Population of excited-states of small admixtures in germanium |
Type |
Conference Article |
Year  |
1978 |
Publication |
Izv. Akad. Nauk SSSR, Seriya Fizicheskaya |
Abbreviated Journal |
Izv. Akad. Nauk SSSR, Seriya Fizicheskaya |
| Volume |
42 |
Issue |
6 |
Pages |
1154-1159 |
| Keywords |
Ge, excited states, admixtures |
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Mezhdunarodnaya Kniga 39 Dimitrova Ul., 113095 Moscow, Russia |
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1723 |
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| Author |
Prober, D. E. |
| Title |
Superconducting terahertz mixer using a transition-edge microbolometer |
Type |
Journal Article |
| Year |
1993 |
Publication |
Appl. Phys. Lett. |
Abbreviated Journal |
Appl. Phys. Lett. |
| Volume |
62 |
Issue |
17 |
Pages |
2119-2121 |
| Keywords |
HEB mixer, NbN, TES |
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Recommended by Klapwijk |
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no |
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244 |
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| Author |
Hoevers, H. F. C.; Bento, A. C.; Bruijn, M. P.; Gottardi, L.; Korevaar, M. A. N.; Mels, W. A.; de Korte, P. A. J. |
| Title |
Thermal fluctuation noise in a voltage biased superconducting transition edge thermometer |
Type |
Journal Article |
| Year |
2000 |
Publication |
Applied Physics Letters |
Abbreviated Journal |
Appl. Phys. Lett. |
| Volume |
77 |
Issue |
26 |
Pages |
4421-4424 |
| Keywords |
TES; bolometer; thermal fluctuation noise; TFN |
| Abstract |
The current noise at the output of a microcalorimeter with a voltage biased superconducting transition edge thermometer is studied in detail. In addition to the two well-known noise sources: thermal fluctuation noise from the heat link to the bath and Johnson noise from the resistive thermometer, a third noise source strongly correlated with the steepness of the thermometer is required to fit the measured noise spectra. Thermal fluctuation noise, originating in the thermometer itself, fully explains the additional noise. A simple model provides quantitative agreement between the observed and calculated noise spectra for all bias points in the superconducting transition. |
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RPLAB @ gujma @ |
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759 |
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Manus, M. K. Mc; Kash, J. A.; Steen, S. E.; Polonsky, S.; Tsang, J.C.; Knebel, D. R.; Huott, W. |
| Title |
PICA: Backside failure analysis of CMOS circuits using picosecond imaging circuit analysis |
Type |
Journal Article |
| Year |
2000 |
Publication |
Microelectronics Reliability |
Abbreviated Journal |
Microelectronics Reliability |
| Volume |
40 |
Issue |
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Pages |
1353-1358 |
| Keywords |
SSPD, CMOS testing |
| Abstract |
Normal operation of complementary metal-oxide semiconductor (CMOS) devices entails the emission of picosecond pulses of light, which can be used to diagnose circuit problems. The pulses that are observed from submicron sized field effect transistors (FETs) are synchronous with logic state switching. Picosecond Imaging Circuit Analysis (PICA), a new optical imaging technique combining imaging with timing, spatially resolves individual devices at the 0.5 micron level and switching events on a 10 picosecond timescale. PICA is used here for the diagnostics of failures on two VLSI microprocessors. |
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1054 |
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| Author |
Stellari, Franco; Song, Peilin |
| Title |
Testing of ultra low voltage CMOS microprocessors using the superconducting single-photon detector (SSPD) |
Type |
Conference Article |
| Year |
2005 |
Publication |
Proc. 12th IPFA |
Abbreviated Journal |
Proc. 12th IPFA |
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Pages |
2 |
| Keywords |
SSPD, CMOS testing |
| Abstract |
In F. Stellari and P. Song (2004) the authors have shown a comparison among different detectors used for diagnosing integrated circuits (ICs) by means of the PICA method. In their experiments they used two versions of the SSPD detector (p-SSPD is a prototype version, while c-SSPD is the first commercially available generation of the detector as presented in W. K. Lo et al. (2002), as well as the imaging detector (S-25 photo-multiplier tube (PMT) as discussed in W. G. McMullan (1987)) used in the conventional PICA technique. A microprocessor chip fabricated in a 0.13 μm 1.2 V technology is used to show that c-SSPD provides a significant reduction in acquisition time for the collection of optical waveforms from chips running at very low. In this paper, the authors summarize the main results. |
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IEEE |
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0-7803-9301-5 |
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1055 |
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