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Loudkov D, Tong CYE, Blundell R, Kaurova N, Grishina E, Voronov B, et al. An investigation of the performance of the superconducting HEB슠mixer as a function of its RF슠embedding impedance. IEEE Trans. Appl. Supercond.. 2005;15(2):472–5.
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Hans Ekstrom, Karasik BS, Kollberg EL, Sigfrid Yngvesson. Conversion gain and noise of niobium superconducting hot–electron–mixers. IEEE Trans. Appl. Supercond.. 1995;43(4):938–47.
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Schubert J, Semenov A, Gol'tsman G, Hübers H-W, Schwaab G, Voronov B, et al. Noise temperature of an NbN hot-electron bolometric mixer at frequencies from 0.7 THz to 5.2 THz. Supercond. Sci. Technol.. 1999;12(11):748–50.
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Kroug M, Cherednichenko S, Choumas M, Merkel H, Kollberg E, Hübers H-W, et al. HEB quasi-optical heterodyne receiver for THz frequencies. In: Proc. 12th Int. Symp. Space Terahertz Technol. San Diego, CA, USA; 2001. p. 244–52.
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Semenov AD, Hübers H-W, Richter H, Birk M, Krocka M, Mair U, et al. Superconducting hot-electron bolometer mixer for terahertz heterodyne receivers. IEEE Trans. Appl. Supercond.. 2003;13(2):168–71.
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Kaurova NS, Finkel MI, Maslennikov SN, Vahtomin YB, Antipov SV, Smirnov KV, et al. Submillimeter mixer based on YBa2Cu3O7-x thin film. In: Proc. 1-st conf. Fundamental problems of high temperature superconductivity. Moscow-Zvenigorod; 2004. 291.
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Bruderer S, Benz AO, van Dishoeck EF, Melchior M, Doty SD, van der Tak F, et al. Herschel/HIFI detections of hydrides towards AFGL 2591. Envelope emission versus tenuous cloud absorption. Astron. Astrophys.. 2010;521:L44 (1 to 7).
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Gol'tsman GN, Loudkov DN. Terahertz superconducting hot-electron bolometer mixers and their application in radio astronomy. Radiophys. Quant. Electron.. 2003;46(8/9):604–17.
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Gerecht E, Musante CF, Zhuang Y, Ji M, Yngvesson KS, Goyette T, et al. NbN hot electron bolometric mixer with intrinsic receiver noise temperature of less than five times the quantum noise limit. In: Proc. IMS. Vol 2.; 2000. p. 1007–10.
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Maezawa H. Application of superconducting hot-electron bolometer mixers for terahertz-band astronomy. IEICE Trans. Electronics. 2015;98(3):196–206.
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