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Zolotov PI, Divochiy AV, Vakhtomin YB, Morozov PV, Seleznev VA, Smirnov KV. Development of high-effective superconducting single-photon detectors aimed for mid-IR spectrum range. In: J. Phys.: Conf. Ser. Vol 917.; 2017. 062037.
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Korneeva Y, Florya I, Vdovichev S, Moshkova M, Simonov N, Kaurova N, et al. Comparison of hot-spot formation in NbN and MoN thin superconducting films after photon absorption. In: IEEE Transactions on Applied Superconductivity. Vol 27.; 2017. 5.
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Klapwijk TM, Semenov AV. Engineering physics of superconducting hot-electron bolometer mixers. IEEE Trans THz Sci Technol. 2017;7(6):627–48.
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Finkel M, Thierschmann H, Galatro L, Katan AJ, Thoen DJ, de Visser PJ, et al. Performance of THz components based on microstrip PECVD SiNx technology. IEEE Trans THz Sci Technol. 2017;7(6):765–71.
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Krause S, Mityashkin V, Antipov S, Gol’tsman G, Meledin D, Desmaris V, et al. Reduction of phonon escape time for nbn hot electron bolometers by using gan buffer layers. IEEE Trans Terahertz Sci Technol. 2017;7(1):53–9.
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Lobanov Y, Shcherbatenko M, Semenov A, Kovalyuk V, Kahl O, Ferrari S, et al. Superconducting nanowire single photon detector for coherent detection of weak signals. IEEE Trans Appl Supercond. 2017;27(4):1–5.
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Trifonov A, Tong C-YE, Grimes P, Lobanov Y, Kaurova N, Blundell R, et al. Development of A Silicon Membrane-based Multi-pixel Hot Electron Bolometer Receiver. In: IEEE Trans. Appl. Supercond. Vol 27.; 2017. 6.
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Titova N, Kardakova AI, Tovpeko N, Ryabchun S, Mandal S, Morozov D, et al. Slow electron–phonon cooling in superconducting diamond films. IEEE Trans Appl Supercond. 2017;27(4):1–4.
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Trifonov A, Tong C-YE, Grimes P, Lobanov Y, Kaurova N, Blundell R, et al. Development of a silicon membrane-based multipixel hot electron bolometer receiver. IEEE Trans Appl Supercond. 2017;27(4):1–5.
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Korneeva Y, Florya I, Vdovichev S, Moshkova M, Simonov N, Kaurova N, et al. Comparison of hot spot formation in nbn and mon thin superconducting films after photon absorption. IEEE Trans Appl Supercond. 2017;27(4):1–4.
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