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Lobanov Y, Tong C, Blundell R, Gol'tsman G. A study of direct detection effect on the linearity of hot electron bolometer mixers. In: Proc. 20th Int. Symp. Space Terahertz Technol.; 2009. p. 282–7.
Abstract: We have performed a study of how direct detection affects the linearity and hence the calibration of an HEB mixer. Two types of waveguide HEB devices have been used: a 0.8 THz HEB mixer and a 1.0 THz HEB mixer which is ~5 times smaller than the former. Two independent experimental approaches were used. In the ΔG/G method, the conversion gain of the HEB mixer is first measured as a function of the bias current for a number of bias voltages. At each bias setting, we carefully measure the change in the operating current when the input loads are switched. From the measured data, we can derive the expected difference in gain between the hot and cold loads. In the second method (injection method [1]), the linearity of the HEB mixer is independently measured by injecting a modulated signal for different input load temperatures. The results of both approaches confirm that there is gain compression in the operation of HEB mixers. Based on the results of our measurements, we discuss the impact of direct detection effects on the operation of HEB mixers.
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Tong C-YE, Meledin DV, Marrone DP, Paine SN, Gibson H, Blundell R. Near field vector beam measurements at 1 THz. IEEE Microw. Compon. Lett.. 2003;13(6):235–7.
Abstract: We have performed near-field vector beam measurements at 1.03 THz to characterize and align the receiver optics of a superconducting receiver. The signal source is a harmonic generator mounted on an X-Y translation stage. We model the measured two-dimensional complex beam pattern by a fundamental Gaussian mode, from which we derive the position of the beam center, the beam radius and the direction of propagation. By performing scans in the planes separated by 400 mm, we have confirmed that our beam pattern measurements are highly reliable.
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Kawamura J, Blundell R, Tong C-YE, Gol'tsman G, Gershenzon E, Voronov B. NbN hot-electron mixer measurements at 200 GHz. In: Proc. 6th Int. Symp. Space Terahertz Technol.; 1995. p. 254–61.
Abstract: We present noise and gain measurements of resistively driven NbN hot-electron mixers near 200 GHz. The device geometry is chosen so that the dominant cooling process of the hot-electrons is their interaction with the lattice. Except for a single batch, the intermediate frequency cut-off of these mixer elements is – 3 700 MHz, and has shown little variation among other batches of devices. At 100 MHz we measured intrinsic mixer losses as low as —3 dB. We measured the noise temperatures at several intermediate frequencies, and for the best de- vice at 137 MHz with 20 MHz bandwidth, we measured 2000 K; using a low-noise first- stage amplifier at 1.5 GHz with 200 MHz bandwidth, the receiver noise temperature measured 2800 K. We estimate that the noise contribution from the mixer is 500 K and the total losses are —15 dB at 137 MHz.
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Trifonov A, Tong CE, Lobanov Y, Kaurova N, Blundell R, Gol’tsman G. An investigation of the DC and IF performance of silicon-membrane HEB mixer elements. In: Proc. 26th Int. Symp. Space Terahertz Technol.; 2015. 40.
Abstract: We report on our initial development towards a 2x2 multi-pixel HEB waveguide mixer for operation at 1.4 THz. We have successfully fabricated devices comprising an NbN bridge integrated with antenna test structure using a silicon membrane as the supporting substrate. DC measurements of the test chips demonstrate critical current from 0.1 – 1mA depending on the size of device, with T c of around 10 K and ΔTc ~ 0.8 K.
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Trifonov A, Tong C-YE, Grimes P, Lobanov Y, Kaurova N, Blundell R, et al. Development of A Silicon Membrane-based Multi-pixel Hot Electron Bolometer Receiver. In: IEEE Trans. Appl. Supercond. Vol 27.; 2017. 6.
Abstract: We report on the development of a multi-pixel
Hot Electron Bolometer (HEB) receiver fabricated using
silicon membrane technology. The receiver comprises a
2 × 2 array of four HEB mixers, fabricated on a single
chip. The HEB mixer chip is based on a superconducting
NbN thin film deposited on top of the silicon-on-insulator
(SOI) substrate. The thicknesses of the device layer and
handling layer of the SOI substrate are 20 μm and 300 μm
respectively. The thickness of the device layer is chosen
such that it corresponds to a quarter-wave in silicon at
1.35 THz. The HEB mixer is integrated with a bow-tie
antenna structure, in turn designed for coupling to a
circular waveguide,
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