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Torgashin MY, Koshelets VP, Dmitriev PN, Ermakov AB, Filippenko LV, Yagoubov PA. Superconducting integrated receivers based on Nb-AlN-NbN circuits. IEEE Trans. Appl. Supercond.. 2007;17(2):379–82.
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Gerecht E, Musante CF, Wang Z, Yngvesson KS, Mueller ER, Waldman J, et al. Optimization of hot eleciron bolometer mixing efficiency in NbN at 119 micrometer wavelength. In: Proc. 7th Int. Symp. Space Terahertz Technol.; 1996. p. 584–600.
Abstract: We describe an investigation of a NbN HEB mixer for 2.5 THz. An intrinsic conversion loss of 23 dB has been measured with a two-laser measurement technique. The conversion loss was limited by the LO power available and is expected to decrease to 10 dB or less when sufficient LO power is available. For this initial experiment we used a prototype device which is directly coupled to the laser beams. We present results for a back-short technique that improves the optical coupling to the device and describe our progress for an antenna-coupled device with a smaller dimension. Based on our measured data for conversion loss and device output noise level, we predict that NbN HEB mixers will be capable of achieving DSB receiver noise temperatures of ten times the quantum noise limit in the THz range.
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Koshelets VP, Shitov SV, Ermakov AB, Filippenko LV, Koryukin OV, Khudchenko AV, et al. Superconducting integrated receiver for TELIS. IEEE Trans. Appl. Supercond.. 2005;15(2):960–3.
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Koshelets VP, Ermakov AB, Filippenko LV, Koryukin OV, Khudchenko AV, Sobolev AS, et al. Superconducting submm integrated receiver for TELIS. In: J. Phys.: Conf. Ser. Vol 43.; 2006. p. 1377–80.
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Svechnikov SI, Okunev OV, Yagoubov PA, Gol'tsman GN, Voronov BM, Cherednichenko SI, et al. 2.5 THz NbN hot electron mixer with integrated tapered slot antenna. IEEE Trans Appl Supercond. 1997;7(2):3548–51.
Abstract: A Hot Electron Bolometer (HEB) mixer for 2.5 THz utilizing a NbN thin film device, integrated with a Broken Linearly Tapered Slot Antenna (BLTSA), has been fabricated and is presently being tested. The NbN HEB device and the antenna were fabricated on a SiO2membrane. A 0.5 micrometer thick SiO2layer was grown by rf magnetron reactive sputtering on a GaAs wafer. The HEB device (phonon-cooled type) was produced as several parallel strips, 1 micrometer wide, from an ultrathin NbN film 4-7 nm thick, that was deposited onto the SiO2layer by dc magnetron reactive sputtering. The BLTSA was photoetched in a multilayer Ti-Au metallization. In order to strengthen the membrane, the front-side of the wafer was coated with a 5 micrometer thick polyimide layer just before the membrane formation. The last operation was anisotropic etching of the GaAs in a mixture of HNO3and H2O2.
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