|
|
de Lange G, Kuipers JJ, Klapwijk TM, Panhuyzen RA, van de Stadt H, de Graauw MWM. Superconducting resonator circuits at frequencies above the gap frequency. J. Appl. Phys.. 1995;77(4):1795–804.
|
|
|
|
Khosropanah P, Gao JR, Laauwen WM, Hajenius M, Klapwijk TM. Low noise NbN hot electron bolometer mixer at 4.3 THz. Appl Phys Lett. 2007;91:221111 (1 to 3).
Abstract: We have studied the sensitivity of a superconducting NbN hot electron bolometer mixer integrated with a spiral antenna at 4.3 THz. Using hot/cold blackbody loads and a beam splitter all in vacuum, we measured a double sideband receiver noise temperature of 1300 K at the optimum local oscillator (LO) power of 330 nW, which is about 12 times the quantum noise (hnu/2kB). Our result indicates that there is no sign of degradation of the mixing process at the superterahertz frequencies. Moreover, a measurement method is introduced which allows us for an accurate determination of the sensitivity despite LO power fluctuations.
|
|
|
|
Ganzevles WFM, Gao JR, de Korte PAJ, Klapwijk TM. Direct response of microstrip line coupled Nb THz hot-electron bolometer mixers. Appl Phys Lett. 2001;79(15):2483–5.
|
|
|
|
Jackson BD, Baryshev AM, de Lange G, Gao JR, Shitov SV, Iosad NN, et al. Low-noise 1 THz superconductor-insulator-superconductor mixer incorporating a NbTiN/SiO2/Al tuning circuit. Appl. Phys. Lett.. 2001;79(3):436.
|
|
|
|
Hajenius M, Baselmans JJA, Gao JR, Klapwijk TM, de Korte PAJ, Voronov B, et al. Improved NbN phonon cooled hot electron bolometer mixers. In: Proc. 14th Int. Symp. Space Terahertz Technol. Tucson, USA; 2003. p. 413–23.
Abstract: NbN phonon-cooled hot electron bolometer mixers (HEBs) have been realized with negligible contact resistance to Au pads. By adding either a 5 nm Nb or a 10 nm NbTiN layer between the Au and NbN, to preserve superconductivity in the NbN under the Au contact pad, superior noise temperatures have been obtained. Using DC I,V curves and resistive transitions in combination with process parameters we analyze the nature of these improved devices and determine interface transparencies.
|
|
