Finkel M, Thierschmann HR, Galatro L, Katan AJ, Thoen DJ, de Visser PJ, et al. Branchline and directional THz coupler based on PECVD SiNx-technology. In: 41st IRMMW-THz.; 2016.
Abstract: A fabrication technology to realize THz microstrip lines and passive circuit components is developed and tested making use of a plasma-enhanced chemical vapor deposition grown silicon nitride (PECVD SiNx) dielectric membrane. We use 2 μm thick SiNx and 300 nm thick gold layers on sapphire substrates. We fabricate a set of structures for thru-reflect-line (TRL) calibration, with the reflection standard implemented as a short through the via. We find losses of 9.5 dB/mm at 300 GHz for a 50 Ohm line. For a branchline coupler we measure 2.5 dB insertion loss, 1 dB amplitude imbalance and 21 dB isolation. Good control over the THz lines parameters is proven by similar performance of a set of 5 structures. The directional couplers show -14 dB transmission to the coupled port, -24 dB to the isolated port and -25 dB in reflection. The SiNx membrane, used as a dielectric, is compatible with atomic force microscopy (AFM) cantilevers allowing the application of this technology to the development of a THz near-field microscope.
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Korneeva Y, Vodolazov D, Florya I, Manova N, Smirnov E, Korneev A, et al. Single photon detection in micron scale NbN and α-MoSi superconducting strips. In: EPJ Web Conf. Vol 190.; 2018. 04010 (1 to 2).
Abstract: We experimentally demonstrate the single photon detection in straight micrometer-wide NbN and α-MoSi bridges. Width of the bridges is 2 µm, while the wavelength of the photon changes from 408 to 1550 nm and critical current exceeds 50% of the depairing current. Obtained results offer the alternative route for design of detectors without resonator and meander structure and indirectly confirm vortex assisted mechanism of single photon detection.
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Gao JR, Hajenius M, Tichelaar FD, Voronov B, Grishina E, Klapwijk TM, et al. Can NbN films on 3C-SiC/Si change the IF bandwidth of hot electron bolometer mixers? In: Proc. 17th Int. Symp. Space Terahertz Technol.; 2006. p. 187–9.
Abstract: We realized ultra thin NbN films sputtered grown on a 3C-SiC/Si substrate. The film with a thickness of 3.5-4.5 nm shows a 1', of 11.8 K, which is the highest I`, observed among ultra thin NbN films on different substrates. The high-resolution transmission electron microscopy (HRTEM) studies show that the film has a monocrystalline structure, confirming the epitaxial growth on the 3C-SiC. Based on a two-temperature model and input parameters from standard NbN films on Si, simulations predict that the new film can increase the IF bandwidth of a HEB mixer by about a factor of 2 in comparison to the standard films. In addition, we find standard NbN films on Si with a T c of 9.4 K have a thickness of around 5.5 nm, being thicker than expected (3.5 nm).
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Yang ZQ, Hajenius M, Baselmans JJA, Gao JR, Klapwijk TM, Voronov B, et al. Improved sensitivity of NbN hot electron bolometer mixers by vacuum baking. In: Proc. 16th Int. Symp. Space Terahertz Technol.; 2005. p. 222–5.
Abstract: We find that the sensitivity of heterodyne receivers based on superconducting hot-electron bolometer (HEB) in- creases by 25 − 30% after baking at 85 o C and in a high vacuum. The devices studied are twin-slot antenna coupled HEB mixers with a small NbN bridge of 1×0.15 μm 2 . The mixer noise temperature, gain, and resistance versus temperature curve of a HEB before and after baking are compared and analyzed. We show that baking reduces the intrinsic noise of the mixer by 37 % and makes the superconducting transition of the bridge and the contacts sharper. We argue that the reduction of the noise is due to the improvement of the transparency of the contact/film interface. The lowest receiver noise temperature of 700 K is measured at a local oscillator frequency of 1.63 THz and a bath temperature of 4.3 K.
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Gao JR, Hajenius M, Baselmans JJA, Yang ZQ, Baryshev AM, Barends R, et al. Twin-slot antenna coupled NbN hot electron bolometer mixers for space applications. In: Proc. 9-th WMSCI. Vol 9. International Institute of Informatics and Systemics; 2005. p. 148–53.
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