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Author Miller, Aaron J.; Lita, Adriana E.; Calkins, Brice; Vayshenker, Igor; Gruber, Steven M.; Nam, Sae Woo openurl 
  Title Compact cryogenic self-aligning fiber-to-detector coupling with losses below one percent Type Journal Article
  Year 2011 Publication Optics Express Abbreviated Journal Opt. Express  
  Volume 19 Issue 10 Pages 9102-9110  
  Keywords TES  
  Abstract We present a compact packaging technique for coupling light from a single-mode telecommunication fiber to cryogenic single-photon sensitive devices. Our single-photon detectors are superconducting transition-edge sensors (TESs) with a collection area only a factor of a few larger than the area of the fiber core which presents significant challenges to low-loss fiber-to-detector coupling. The coupling method presented here has low loss, cryogenic compatibility, easy and reproducible assembly and low component cost. The system efficiency of the packaged single-photon counting detectors is verified by the “triplet method” of power-source calibration along with the “multiple attenuator” method that produces a calibrated single-photon flux. These calibration techniques, when used in combination with through-wafer imaging and fiber back-reflection measurements, give us confidence that we have achieved coupling losses below 1 % for all devices packaged according to the self-alignment method presented in this paper.  
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  Notes (up) Approved no  
  Call Number RPLAB @ gujma @ Serial 666  
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Author Hoevers, H. F. C.; Bento, A. C.; Bruijn, M. P.; Gottardi, L.; Korevaar, M. A. N.; Mels, W. A.; de Korte, P. A. J. openurl 
  Title Thermal fluctuation noise in a voltage biased superconducting transition edge thermometer Type Journal Article
  Year 2000 Publication Applied Physics Letters Abbreviated Journal Appl. Phys. Lett.  
  Volume 77 Issue 26 Pages 4421-4424  
  Keywords TES; bolometer; thermal fluctuation noise; TFN  
  Abstract The current noise at the output of a microcalorimeter with a voltage biased superconducting transition edge thermometer is studied in detail. In addition to the two well-known noise sources: thermal fluctuation noise from the heat link to the bath and Johnson noise from the resistive thermometer, a third noise source strongly correlated with the steepness of the thermometer is required to fit the measured noise spectra. Thermal fluctuation noise, originating in the thermometer itself, fully explains the additional noise. A simple model provides quantitative agreement between the observed and calculated noise spectra for all bias points in the superconducting transition.  
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  Notes (up) Approved no  
  Call Number RPLAB @ gujma @ Serial 759  
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Author Kooi, Jacob Willem pdf  isbn
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  Title Advanced receivers for submillimeter and far infrared astronomy Type Book Whole
  Year 2008 Publication University of Groningen Abbreviated Journal RUG  
  Volume Issue Pages  
  Keywords HEB, SIS, TES, NEP, noise temperature, IF bandwidth, waveguide, impedance, conversion gain, FTS, integrated array, stability, Allan variance, multi-layer antireflection coating  
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  Corporate Author Thesis Doctoral thesis  
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  ISSN ISBN 978-90-367-3653-4 Medium  
  Area Expedition Conference  
  Notes (up) Approved no  
  Call Number Serial 881  
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Author Titova, N; Kardakova, A.; Tovpeko, N; Ryabchun, S.; Mandal, S.; Morozov, D.; Klemencic, G. M.; Giblin, S.R.; Williams, O. A.; Goltsman, G. N. openurl 
  Title Superconducting diamond films as perspective material for direct THz detectors Type Abstract
  Year 2017 Publication Proc. 28th Int. Symp. Space Terahertz Technol. Abbreviated Journal Proc. 28th Int. Symp. Space Terahertz Technol.  
  Volume Issue Pages 82  
  Keywords KID, HEB, superconducting diamond films, boron-doped diamond films, Al, TiN, Si substrates, NEP  
  Abstract Superconducting films with a high resistivity in the normal state have established themselves as the best materials for direct THz radiation sensors, such as kinetic inductance detectors (KIDs) [1] and hot electron bolometers (nano-HEBs) [2]. The primary characteristics of the future instrument such as the sensitivity and the response time are determined by the material parameters such as the electron-phonon (e-ph) interaction time, the electron density and the resistivity of the material. For direct detectors, such as KIDs and nano-HEBs, to provide a high sensitivity and low noise one prefer materials with long e-ph relaxation times and low values of the electron density. As a potential material for THz radiation detection we have studied superconducting diamond films. A significant interest to diamond for the development of electronic devices is due to the evolution of its properties with the boron dopant concentration. At a high boron doping concentration, n B ~5·10 20 cm -3 , diamond has been reported to become a superconducting with T c depending on the doping level. Our previous study of energy relaxation in single-crystalline boron-doped diamond films epitaxially grown on a diamond shows a remarkably slow energy-relaxation at low temperatures. The electron-phonon cooling time varies from 400 ns to 700 ns over the temperature range 2.2 K to 1.7 K [3]. In superconducting materials such as Al and TiN, traditionally used in KIDs, the e-ph cooling times at 1.7 K correspond to ~20 ns [4] and ~100 ns [5], correspondingly. Such a noticeable slow e-ph relaxation in boron-doped diamond, in combination with a low value of carrier density (~10 21 cm -3 ) in comparison with typical metals (~10 23 cm -3 ) and a high normal state resistivity (~1500 μΩ·cm) confirms a potential of superconducting diamond for superconducting bolometers and resonator detectors. However, the price and the small substrate growth are of single crystal diamond limit practical applications of homoepitaxial diamond films. As an alternative way with more convenient technology, one can employ heteroepitaxial diamond films grown on large-size Si substrates. Here we report about measurements of e-ph cooling times in superconducting diamond grown on silicon substrate and discuss our expectations about the applicability of boron-doped diamond films to superconducting detectors. Our estimation of limit value of noise-equivalent power (NEP) and the energy resolution of bolometer made from superconducting diamond is order 10 -17 W/Hz 1/2 at 2 K and the energy resolution is of 0.1 eV that corresponds to counting single-photon up to 15 um. The estimation was obtained by using the film thickness of 70 nm and ρ ~ 1500 μΩ·cm, and the planar dimensions that are chosen to couple bolometer with 75 Ω log-spiral antenna. Although the value of NEP is far yet from what might like to have for certain astronomical applications, we believe that it can be improved by a suitable fabrication process. Also the direct detectors, based on superconducting diamond, will offer low noise performance at about 2 K, a temperature provided by inexpensive close-cycle refrigerators, which provides another practical advantage of development and application of these devices. [1] P.K. Day, et. al, Nature, 425, 817, 2003. [2] J. Wei, et al, Nature Nanotech., 3, 496, 2008. [3] A. Kardakova, et al, Phys. Rev. B, 93, 064506, 2016. [4] P. Santhanam and D. Prober, Phys. Rev. B, 29, 3733, 1984 [5] A. Kardakova, et al, Appl. Phys. Lett, vol. 103, p. 252602, 2013.  
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  Notes (up) Approved no  
  Call Number Serial 1173  
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Author Manus, M. K. Mc; Kash, J. A.; Steen, S. E.; Polonsky, S.; Tsang, J.C.; Knebel, D. R.; Huott, W. doi  openurl
  Title PICA: Backside failure analysis of CMOS circuits using picosecond imaging circuit analysis Type Journal Article
  Year 2000 Publication Microelectronics Reliability Abbreviated Journal Microelectronics Reliability  
  Volume 40 Issue Pages 1353-1358  
  Keywords SSPD, CMOS testing  
  Abstract Normal operation of complementary metal-oxide semiconductor (CMOS) devices entails the emission of picosecond pulses of light, which can be used to diagnose circuit problems. The pulses that are observed from submicron sized field effect transistors (FETs) are synchronous with logic state switching. Picosecond Imaging Circuit Analysis (PICA), a new optical imaging technique combining imaging with timing, spatially resolves individual devices at the 0.5 micron level and switching events on a 10 picosecond timescale. PICA is used here for the diagnostics of failures on two VLSI microprocessors.  
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  Area Expedition Conference  
  Notes (up) Approved no  
  Call Number Serial 1054  
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