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Finkel, M.; Thierschmann, H. R.; Galatro, L.; Katan, A. J.; Thoen, D. J.; de Visser, P. J.; Spirito, M.; Klapwijk, T. M. |
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Branchline and directional THz coupler based on PECVD SiNx-technology |
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Conference Article |
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2016 |
Publication |
41st IRMMW-THz |
Abbreviated Journal |
41st IRMMW-THz |
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microstrip, fixtures, coplanar waveguides, couplers, standards, probes, dielectrics |
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A fabrication technology to realize THz microstrip lines and passive circuit components is developed and tested making use of a plasma-enhanced chemical vapor deposition grown silicon nitride (PECVD SiNx) dielectric membrane. We use 2 μm thick SiNx and 300 nm thick gold layers on sapphire substrates. We fabricate a set of structures for thru-reflect-line (TRL) calibration, with the reflection standard implemented as a short through the via. We find losses of 9.5 dB/mm at 300 GHz for a 50 Ohm line. For a branchline coupler we measure 2.5 dB insertion loss, 1 dB amplitude imbalance and 21 dB isolation. Good control over the THz lines parameters is proven by similar performance of a set of 5 structures. The directional couplers show -14 dB transmission to the coupled port, -24 dB to the isolated port and -25 dB in reflection. The SiNx membrane, used as a dielectric, is compatible with atomic force microscopy (AFM) cantilevers allowing the application of this technology to the development of a THz near-field microscope. |
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2162-2035 |
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978-1-4673-8485-8 |
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7758586 |
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1295 |
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Irimajiri, Y.; Kumagai, M.; Morohashi, I.; Kawakami, A.; Nagano, S.; Sekine, N.; Ochiai, S.; Tanaka, S.; Hanado, Y.; Uzawa, Y.; Hosako, I. |
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Title |
Phase-locking of a THz-QCL using a Low Noise HEB mixer, and a Frequency-comb as a Reference |
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Conference Article |
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2014 |
Publication |
39th Int. Conf. IRMMW-THz |
Abbreviated Journal |
39th Int. Conf. IRMMW-THz |
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1-2 |
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We have developed a phase-locking system of a 3.1THz QCL (Quantum Cascade Laser) using a low noise hot electron bolometer mixer (HEBM) and a THz reference. The THz reference was generated by photomixing two optical modes of a frequency comb. The THz-QCL and HEBM devices are fabricated in our laboratory. A line width of the phase-locked QCL of narrower than 1Hz was achieved. |
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978-1-4799-3877-3 |
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RPLAB @ atomics90 @ |
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969 |
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Pentin, I. V.; Smirnov, A. V.; Ryabchun, S. A.; Gol’tsman, G. N.; Vaks, V. L.; Pripolzin, S. I.; Paveliev, D. G. |
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Heterodyne source of THz range based on semiconductor superlattice multiplier |
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2011 |
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IRMMW-THz |
Abbreviated Journal |
IRMMW-THz |
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1-2 |
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NbN HEB mixer, superlattice |
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We present the results of our studies of the possibility of developing a heterodyne receiver incorporating a hot-electron bolometer mixer as the detector and a semiconductor superlattice multiplier driven by a reference synthesizer as the local oscillator. We observe that such a local oscillator offers enough power in the terahertz range to pump the HEB into the operating state. |
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6105209 |
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1384 |
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Tretyakov, I.; Svyatodukh, S.; Chumakova, A.; Perepelitsa, A.; Kaurova, N.; Shurakov, A.; Zilberley, T.; Ryabchun, S.; Smirnov, M.; Ovchinnikov, O.; Goltsman, G. |
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Room temperature silicon detector for IR range coated with Ag2S quantum dots |
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Conference Article |
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2019 |
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IRMMW-THz |
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Ag2S quantum dots |
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A silicon has been the chief technological semiconducting material of modern microelectronics and has had a strong influence on all aspects of society. Applications of Si-based optoelectronic devices are limited to the visible and near infrared ranges. The expansion of the Si absorption to shorter wavelengths of the infrared range is of considerable interest to optoelectronic applications. By creating impurity states in Si it is possible to cause sub-band gap photon absorption. Here, we present an elegant and effective technology of extending the photoresponse of towards the IR range. Our approach is based on the use of Ag 2 S quantum dots (QDs) planted on the surface of Si. The specific sensitivity of the Ag 2 S/Si heterostructure is 10 11 cm√HzW -1 at 1.55μm. Our findings open a path towards the future study and development of Si detectors for technological applications. |
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2162-2035 |
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978-1-5386-8285-2 |
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8874267 |
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1286 |
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