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Kawamura, J., Blundell, R., Tong, C. - Y. E., Papa, D. C., Hunter, T. R., Paine, S. N., et al. (2000). Superconductive hot-electron-bolometer mixer receiver for 800-GHz operation. IEEE Trans. Microw. Theory Techn., 48(4), 683–689.
Abstract: In this paper, we describe a superconductive hot-electron-bolometer mixer receiver designed to operate in the partially transmissive 350-μm atmospheric window. The receiver employs an NbN thin-film microbridge as the mixer element, in which the main cooling mechanism of the hot electrons is through electron-phonon interaction. At a local-oscillator frequency of 808 GHz, the measured double-sideband receiver noise temperature is TRX=970 K, across a 1-GHz intermediate-frequency bandwidth centered at 1.8 GHz. We have measured the linearity of the receiver and the amount of local-oscillator power incident on the mixer for optimal operation, which is PLO≈1 μW. This receiver was used in making observations as a facility instrument at the Heinrich Hertz Telescope, Mt. Graham, AZ, during the 1998-1999 winter observing season.
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Tong, C. Y. E., Chen, L., & Blundell, R. (1997). Theory of distributed mixing and amplification in a superconductingquasi-particle nonlinear transmission line. IEEE Trans. Microw. Theory Techn., 45(7), 1086–1092.
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Tong, C. Y. E., Blundell, R., Paine, S., Papa, D. C., Kawamura, J., Stern, J., et al. (1996). Design and characterization of a 250-350 GHz fixed-tuned superconductor-insulator-insulator receiver. IEEE Trans. Microw. Theory Techn., 44(9), 1548–1556.
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Trifonov, A., Tong, C. - Y. E., Grimes, P., Lobanov, Y., Kaurova, N., Blundell, R., et al. (2017). Development of A Silicon Membrane-based Multi-pixel Hot Electron Bolometer Receiver. In IEEE Trans. Appl. Supercond. (Vol. 27, 6).
Abstract: We report on the development of a multi-pixel
Hot Electron Bolometer (HEB) receiver fabricated using
silicon membrane technology. The receiver comprises a
2 × 2 array of four HEB mixers, fabricated on a single
chip. The HEB mixer chip is based on a superconducting
NbN thin film deposited on top of the silicon-on-insulator
(SOI) substrate. The thicknesses of the device layer and
handling layer of the SOI substrate are 20 μm and 300 μm
respectively. The thickness of the device layer is chosen
such that it corresponds to a quarter-wave in silicon at
1.35 THz. The HEB mixer is integrated with a bow-tie
antenna structure, in turn designed for coupling to a
circular waveguide,
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Trifonov, A., Tong, C. - Y. E., Grimes, P., Lobanov, Y., Kaurova, N., Blundell, R., et al. (2017). Development of a silicon membrane-based multipixel hot electron bolometer receiver. IEEE Trans. Appl. Supercond., 27(4), 1–5.
Abstract: We report on the development of a multipixel hot electron bolometer (HEB) receiver fabricated using silicon membrane technology. The receiver comprises a 2 × 2 array of four HEB mixers, fabricated on a single chip. The HEB mixer chip is based on a superconducting NbN thin-film deposited on top of the silicon-on-insulator (SOI) substrate. The thicknesses of the device layer and handling layer of the SOI substrate are 20 and 300 μm, respectively. The thickness of the device layer is chosen such that it corresponds to a quarter-wave in silicon at 1.35 THz. The HEB mixer is integrated with a bow-tie antenna structure, in turn designed for coupling to a circular waveguide, fed by a monolithic drilled smooth-walled horn array.
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