Venediktov, I. O., Elezov, M. S., Prokhodtsov, A. I., Kovalyuk, V. V., An, P. P., Golikov, A. D., et al. (2020). Study of microheater’s phase modulation for on-chip Kennedy receiver. In J. Phys.: Conf. Ser. (Vol. 1695, 012117).
Abstract: In this work we describe phase modulators for several Mach-Zehnder interferometers (MZI) on silicon nitride platform for telecomm wavelength (1550 nm). We obtained current-voltage and phase-voltage curves for these modulators. MZI are needed for experimental realisation of various quantum receivers that can distinguish weak coherent states of light with extremely low error. Thermo-optical (TO) modulation is ensured by microheaters on one of the arms of MZI, which enables the change of the refractive index of the material with temperature. This approach allows to apply the necessary voltage to the golden microheaters to obtain the required phase change. For the on-chip microheaters we demonstrate the dependence of the phase shift on the voltage applied to our on-chip microheaters.
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Elmanov, I., Sardi, F., Xia, K., Kornher, T., Kovalyuk, V., Prokhodtsov, A., et al. (2020). Development of focusing grating couplers for lithium niobate on insulator platform. In J. Phys.: Conf. Ser. (Vol. 1695, 012127).
Abstract: In this paper, we fabricate and experimentally study focusing grating couplers for lithium niobate on an insulator photonic platform. The transmittance of a waveguide equipped with in- and out-couplers with respect to the grating period is measured with and without silicon dioxide cladding applied. Our results show the influence of silicon dioxide cladding on the efficiency and the central wavelength of grating couplers and can be used to improve grating coupling efficiency. Our study is supported by numerical simulations.
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Zvagelsky, R. D., Chubich, D. A., Kolymagin, D. A., Korostylev, E. V., Kovalyuk, V. V., Prokhodtsov, A. I., et al. (2020). Three-dimensional polymer wire bonds on a chip: morphology and functionality. J. Phys. D: Appl. Phys., 53(35), 355102.
Abstract: Modern microchip-scale transceivers are capable of transmitting data at rates of the order of several terabits per second. In this regard, there is an urgent need to improve the interfaces connecting the chips and extend the bandpass of the interconnections. We use an approach combining silicon nitride nanophotonic circuits with 3D polymer waveguides fabricated by direct laser writing, which can be used as photonic interconnections or photonic wire bonds (PWB). These structures are designed, simulated, fabricated, and optimized for better light transmission at the telecommunication wavelength. An important part of this work is the study of the telecom signal transmission in a 3D polymer waveguide connecting two silicon nitride facing tapers. Two cases are considered: the tapers are one opposite the other or misaligned. Initially, the PWB shape was chosen to be Gaussian and then optimized: the top was circle-shaped and with the lower part still being Gaussian. Transmission losses were measured for both types of waveguides with different shapes. The idea of an optical multi-level crossing for photonic integrated circuits is also suggested as a solution to the problem of interconnections within a single chip.
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