|
|
Yagoubov, P., Kroug, M., Merkel, H., Kollberg, E., Schubert, J., Hubers, H. W., et al. (1999). Hot electron bolometric mixers based on NbN films deposited on MgO substrates. In Inst. Phys. Conf. Ser. (Vol. 167, pp. 687–690). Barcelona, Spain.
|
|
|
|
Maslennikov, S., Antipov, S., Shishkov, A., Svechnikov, S., Voronov, B., Smirnov, K., et al. (2002). NbN HEB mixer noise temperature measurements with hot/cold load mounted inside the helium cryostat at 300 GHz. In Proc. Int. Student Seminar on Microwave Appl. of Novel Physical Phenomena supported by IEEE. St.-Petersburg: LETI.
|
|
|
|
Antipov, S. V., Svechnikov, S. I., Smirnov, K. V., Vakhtomin, Y. B., Finkel, M. I., Goltsman, G. N., et al. (2001). Noise temperature of quasioptical NbN hot electron bolometer mixers at 900 GHz. Physics of Vibrations, 9(4), 242–245.
|
|
|
|
Svechnikov, S. I., Antipov, S. V., Vakhtomin, Y. B., Goltsman, G. N., Gershenzon, E. M., Cherednichenko, S. I., et al. (2001). Conversion and noise bandwidths of terahertz NbN hot-electron bolometer mixers. Physics of Vibrations, 9(3), 205–210.
|
|
|
|
Svechnikov, S. I., Okunev, O. V., Yagoubov, P. A., Gol'tsman, G. N., Voronov, B. M., Cherednichenko, S. I., et al. (1997). 2.5 THz NbN hot electron mixer with integrated tapered slot antenna. IEEE Trans. Appl. Supercond., 7(2), 3548–3551.
Abstract: A Hot Electron Bolometer (HEB) mixer for 2.5 THz utilizing a NbN thin film device, integrated with a Broken Linearly Tapered Slot Antenna (BLTSA), has been fabricated and is presently being tested. The NbN HEB device and the antenna were fabricated on a SiO2membrane. A 0.5 micrometer thick SiO2layer was grown by rf magnetron reactive sputtering on a GaAs wafer. The HEB device (phonon-cooled type) was produced as several parallel strips, 1 micrometer wide, from an ultrathin NbN film 4-7 nm thick, that was deposited onto the SiO2layer by dc magnetron reactive sputtering. The BLTSA was photoetched in a multilayer Ti-Au metallization. In order to strengthen the membrane, the front-side of the wafer was coated with a 5 micrometer thick polyimide layer just before the membrane formation. The last operation was anisotropic etching of the GaAs in a mixture of HNO3and H2O2.
|
|
