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Author Bennett, Douglas A.; Schmidt, Daniel R.; Swetz, Daniel S.; Ullom, Joel N.
Title Phase-slip lines as a resistance mechanism in transition-edge sensors Type Journal Article
Year 2014 Publication Appl. Phys. Lett. Abbreviated Journal Appl. Phys. Lett.
Volume 104 Issue Pages 042602
Keywords (up) microbolometers, TES, phase-slip lines, PSL
Abstract The fundamental mechanism of resistance in voltage-biased superconducting films is poorly understood despite its importance as the basis of transition-edge sensors (TESs). TESs are utilized in state-of-the-art microbolometers and microcalorimeters covering a wide range of energies and applications. We present a model for the resistance of a TES based on phase-slip lines (PSLs) and compare the model to data. One of the model's predictions, discrete changes in the number of PSLs, is a possible explanation for the observed switching between discrete current states in localized regions of bias.
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Notes Recommended by Klapwijk Approved no
Call Number Serial 929
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Author Shcherbatenko, Michael; Lobanov, Yury; Finkel, Matvey; Maslennikov, Sergey; Pentin, Ivan; Semenov, Alexander; Titova, Nadezhda; Kaurova, Natalya; Voronov, Boris M.; Rodin, Alexander; Klapwijk, Teunis M.; Gol’tsman, Gregory N.
Title Development of a 30 THz heterodyne receiver based on a hot-electron-bolometer mixer Type Abstract
Year 2014 Publication Proc. 25th Int. Symp. Space Terahertz Technol. Abbreviated Journal Proc. 25th Int. Symp. Space Terahertz Technol.
Volume Issue Pages 122
Keywords (up) mid-IR NbN HEB mixers, GaAs substrates
Abstract We present new Hot-Electron-Bolometer (HEB) mixers designed for mid-IR spectroscopy targeting astrophysical and geophysical observations where high sensitivity and spectral resolution are required. The mixers are made of an ultrathin NbN film deposited on GaAs substrates. Two entirely different types of the devices have been fabricated. The first type is based on a direct radiation coupling concept and the mixing devices are shaped as squares of 5×5 μm 2 (which corresponds to the diffraction limit at the chosen wavelength) and 10×10 μm 2 (which was used to establish a possible influence of the contact pads on the radiation absorption). The second type utilizes a spiral antenna designed with HFSS. The fabrication and layout of the devices as well as the performance comparison will be presented. During the experiments, the HEB mixer was installed on the cold plate of a LHe cryostat. A germanium window and an extended semi-spherical germanium lens are used to couple the radiation. The cryostat is equipped with a germanium optical filter of thickness 0.5 mm and with a center wavelength of 10.6 mμ. The incident power absorption is measured by using the isothermal method. As a Local Oscillator, a 10.6 micrometers line of a CO2 gas laser is used. We further characterize the frequency response of the spiral antenna with a FIR-spectrometer. The noise characteristics of the mixers are determined from a room temperature cold load and a heated black body at ~600 K as a hot load.
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Notes Approved no
Call Number Serial 1364
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Author Bell, Matthew; Sergeev, Andrei; Goltsman, Gregory; Bird, Jonathan; Verevkin, Aleksandr
Title Transition-edge sensors based on superconducting nanowires Type Abstract
Year 2006 Publication Proc. APS March Meeting Abbreviated Journal Proc. APS March Meeting
Volume Issue Pages B38.00001
Keywords (up) NbN nanowire TES
Abstract We present our experimental study of superconducting NbN nanowire-based sensor. The responsivity of the sensor is strongly affected by the superconducting transition width of the nanostructure, which, in turn, is determined by the phase slip centers (PCSs) dynamics. The fluctuations and noise properties of the sensor are also discussed, as well as the devices' behavior at high magnetic fields. The ultimate performance of the sensor and prospects of the devices will be discussed, as well.
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Notes Approved no
Call Number Serial 1455
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Author Tretyakov, I.; Shurakov, A.; Perepelitsa, A.; Kaurova, N.; Svyatodukh, S.; Zilberley, T.; Ryabchun, S.; Smirnov, M.; Ovchinnikov, O.; Goltsman, G.
Title Silicon room temperature IR detectors coated with Ag2S quantum dots Type Conference Article
Year 2019 Publication Proc. IWQO Abbreviated Journal Proc. IWQO
Volume Issue Pages 369-371
Keywords (up) silicon detector, quantum dot, IR, surface states
Abstract For decades silicon has been the chief technological semiconducting material of modern microelectronics. Application of silicon detectors in optoelectronic devices are limited to the visible and near infrared ranges, due to their transparency for radiation with a wavelength higher than 1.1 μm. The expansion Si absorption towards longer wave lengths is a considerable interest to optoelectronic applications. In this work we present an elegant and effective solution to this problem using Ag2S quantum dots, creating impurity states in Si to cause sub-band gap photon absorption. The sensitivity of room temperature zero-bias Si_Ag2S detectors, which we obtained is 1011 cmHzW . Given the variety of QDs parameters such as: material, dimensions, our results open a path towards the future study and development of Si detectors for technological applications.
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ISSN ISBN 978-5-89513-451-1 Medium
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Notes Approved no
Call Number Serial 1154
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Author Manus, M. K. Mc; Kash, J. A.; Steen, S. E.; Polonsky, S.; Tsang, J.C.; Knebel, D. R.; Huott, W.
Title PICA: Backside failure analysis of CMOS circuits using picosecond imaging circuit analysis Type Journal Article
Year 2000 Publication Microelectronics Reliability Abbreviated Journal Microelectronics Reliability
Volume 40 Issue Pages 1353-1358
Keywords (up) SSPD, CMOS testing
Abstract Normal operation of complementary metal-oxide semiconductor (CMOS) devices entails the emission of picosecond pulses of light, which can be used to diagnose circuit problems. The pulses that are observed from submicron sized field effect transistors (FETs) are synchronous with logic state switching. Picosecond Imaging Circuit Analysis (PICA), a new optical imaging technique combining imaging with timing, spatially resolves individual devices at the 0.5 micron level and switching events on a 10 picosecond timescale. PICA is used here for the diagnostics of failures on two VLSI microprocessors.
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Notes Approved no
Call Number Serial 1054
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