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Bandurin DA, Svintsov D, Gayduchenko I, Xu SG, Principi A, Moskotin M, et al. Resonant terahertz detection using graphene plasmons. Nat Commun. 2018;9:5392 (1 to 8).
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Tretyakov I, Shurakov A, Perepelitsa A, Kaurova N, Svyatodukh S, Zilberley T, et al. Room temperature silicon detector for IR range coated with Ag2S quantum dots. Phys Status Solidi RRL. 2019;13(9):1900187–(1.
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Tretyakov I, Svyatodukh S, Chumakova A, Perepelitsa A, Kaurova N, Shurakov A, et al. Room temperature silicon detector for IR range coated with Ag2S quantum dots. In: IRMMW-THz.; 2019.
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Tretyakov IV, Anfertyev VA, Revin LS, Kaurova NS, Voronov BM, Vaks VL, et al. Sensitivity and resolution of a heterodyne receiver based on the NbN HEB mixer with a quantum-cascade laser as a local oscillator. Radiophys Quant Electron. 2018;60(12):988–92.
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Tretyakov I, Shurakov A, Perepelitsa A, Kaurova N, Svyatodukh S, Zilberley T, et al. Silicon room temperature IR detectors coated with Ag2S quantum dots. In: Proc. IWQO.; 2019. p. 369–71.
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Goltsman GN, Korneev AA, Finkel MI, Divochiy AV, Florya IN, Korneeva YP, et al. Superconducting hot-electron bolometer as THz mixer, direct detector and IR single-photon counter [abstract]. In: 35th Int. Conf. Infrared, Millimeter, and Terahertz Waves.; 2010. p. 1.
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Korneev A, Finkel M, Maslennikov S, Korneeva Y, Florya I, Tarkhov M, et al. Superconducting NbN terahertz detectors and infrared photon counters. Вестник НГУ Серия: физ. 2010;5(4):68–72.
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Tretyakov I, Kaurova N, Raybchun S, Goltsman GN, Silaev AA. Technology for NbN HEB based multipixel matrix of THz range. In: EPJ Web Conf. Vol 195.; 2018. 05011.
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Seliverstov SV, Anfertyev VA, Tretyakov IV, Ozheredov IA, Solyankin PM, Revin LS, et al. Terahertz heterodyne receiver with an electron-heating mixer and a heterodyne based on the quantum-cascade laser. Radiophys Quant Electron. 2017;60(7):518–24.
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Shurakov A, Mikhalev P, Mikhailov D, Mityashkin V, Tretyakov I, Kardakova A, et al. Ti/Au/n-GaAs planar Schottky diode with a moderately Si-doped matching sublayer. Microelectronic Engineering. 2018;195:26–31.
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